Definition: Voids in solder joint, refers to holes, bubbles, gaps, open pockets, empty spaces, inside of the solder joint. Solder void is typically generated by entrapped gasses/vapour or paste flux residues, that were not able to emit/release from solder joint during the reflow process.   What factors might cause solder voiding: ● Solder Paste ● Stencil ● PCB Surface Finish ●...